EMC Paper: Why Signals Are Always a Loss in a High Speed High Frequency Transmission Line

Posted May 7th, 2021

As another service to our customers, TFE likes to offer technical papers on occasion. Today we are pleased to offer this unique and informative 18 page analysis of "Why Signals are always a Loss in a High Speed High Frequency Transmission Line” by Albert Chen from Elite Material Co., Ltd. Taiwan, ROC

Paper Abstract

The high-speed transmission applications in the electronic product have become an inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The material suppliers, PCB manufactures, OEM designer commonly face the serious issue, “How to keep signal integrity operated in the high-speed transmission” for the modern electronic application nowadays.

The material suppliers dedicated into developing lower dielectric constant and dissipation factor material, PCB manufactures define the low loss material and copper foil selection guide and more delicate process handling. The OEM specify the signal integrity form the insertion loss and extracted material Dk / Df from signal loss result. All of these are for keeping signal could be transmitted completely at higher bandwidth. We discuss the following factors affect insertion loss result in this paper, such as material Dk / Df, copper foil type, skin effect, impedance variation, line width, line space, black / brown oxide treatment, dielectric thickness, via stub effect and so on through TDR and VNA measurement and simulation analysis result. 

Download the Full Paper Here