TFE invites you to visit Aismalibar and Technosystem at Productronica 2025, taking place November 18–21 in Munich, Germany. This year marks the 50th anniversary of the world’s premier trade fair for electronics development and production, bringing together over 1,400 exhibitors and thousands of visitors from across the globe.
We are proud to share that Jeff Brandman, President of TFE and President of Aismalibar North America, has recently been appointed to the Membership Committee of the Printed Circuit Board Association of America (PCBAA). In this new role, Jeff will help support and expand PCBAA’s growing community of members, strengthening the organization’s mission to advocate for and advance the domestic PCB industry.
PCB teams need repeatable lamination to protect yields, reduce scrap, and stabilize cycle times. The attached videos highlight how Burkle systems deliver consistent bonding for multilayer builds and flexible throughput for small to mid-volume runs.
Looking for an efficient and accurate solution for blind via holes in high-density PCB layouts? The HPTec 596 Series is a microvia drill with a conical outer diameter, specifically designed for mechanically drilled blind holes across one to three inner layers. Offering the highest hole quality and positioning accuracy, it’s a powerful alternative to laser drilling—especially on multispindle machines.
In power electronics, heat is the enemy. And tight spaces? Even worse. That’s where Flextherm shines; a high-performance conformable insulated metal substrate (IMS) engineered to deliver exceptional thermal conductivity while bending to fit your toughest designs. Literally. Unlike traditional rigid IMS materials, Flextherm allows for precision installation in curved, compact, or irregular assemblies without compromising dielectric strength or reliability.
We’re thrilled to share that Jeff Brandman, President of TFE and Aismalibar North America, has been named one of PCBAA’s 2025 Outstanding Contributors. This recognition celebrates Jeff’s leadership, advocacy, and unwavering commitment to the Printed Circuit Board Association of America (PCBAA) and its mission to strengthen the domestic PCB industry.
In today’s HDI and IC-substrate production environments, precision and consistency are no longer optional—they're essential. Traditional UV nanosecond laser systems have served the industry well, but as design rules shrink and reliability requirements grow, their limitations are becoming increasingly clear. Schmoll Maschinen GmbH has developed an advanced picosecond laser platform that overcomes the thermal and mechanical constraints of earlier-generation systems. By integrating picosecond p...
At IPC APEX EXPO 2025, Don Monn of Electra Polymers sat down with I-Connect007 to share how inkjet technology has evolved since 2016—and why it’s earning serious trust from PCB manufacturers today.
Mylar peeling remains a common bottleneck for high-mix PCB manufacturers — especially as volumes grow and labor costs rise. The TECHNOSYSTEM TS-A25 is a fully automated Mylar peeling system designed to streamline your imaging line, reduce material handling errors, and improve yield on delicate inner and outer layers.
Technosystem’s 2025 catalog is here—packed with automation solutions for high-mix, high-precision PCB production. From LDI loaders and robotic panel handling to full DES line integration, our systems are built to boost throughput and reduce manual steps. Explore how our smart, flexible equipment can future-proof your fab. 👉 Download the catalog now.
