Aismalibar to Attend Productronica 2021

Posted Nov 10th, 2021

The only exhibition of this kind, productronica showcases the entire value chain in electronics manufacturing – from technologies and components to software and services. Over 45,000 professionals attended the conference in 2019 and it continues to grow each year.

After successful participation at productronica 2019, Aismalibar will attend the 2021 Munich event and showcase its latest developments in Thermal laminates for the PCB industry and Thermal Interface Materials.

Aismalibar will showcase in Hall B3, Booth 351 (see map), offering detailed information to those seeking to solve thermal management problems on their PCB designs and offering the ideal solution on high end TIMs.

Aismalibar will present their unique COBRITHERM ULTRATHIN 4W - TG180ºC - 150ºC MOT, an insulated metal substrate (IMS) based on an aluminum cladding with an ED copper sheet on the opposite side, containing an innovative 35um ultra-thin polymer-ceramic dielectric layer of its own formulation. This product offers industry-leading thermal conductivity and high dielectric strength. It also offers strong MOT, High Tg and Low CTE values, which are the key elements for performance of the MPCB operating at high temperatures.

Furthermore, the Thermal Multilayer product range will be presented, as well as products for the development of multilayer PCBs that can be combined to customize solutions for complex electronic designs and applications. The Thermal Cobritherm THIN LAM and BOND SHEET can be used in standard multilayer lamination processes, reducing thermal resistance, improving thermal conductivity, and dissipating temperature much faster without the need to modifying the design of an existing and running project. This can be achieved only by changing the standard FR4 to Cobritherm THIN LAM and Cobritherm BOND SHEETS.

The new Cobritherm of 3.2W THIN LAM and BOND SHEETS have been developed to reduce thermal resistance. A MOT of 150ºC, high Tg values​​of 180ºC and Low CTE below 1.8% (50 to 250ºC) considerably improve overall thermal efficiency. For more information, please visit our website